We offer high-resolution pcb x-ray inspection of:
- BGAs
- Micro BGAs
- Chip scale packages
- Large board capability is also suitable for inspection of bare boards
Faults Inspected
OPENS
Opens are usually caused by insufficient reflow, missing balls, doming, popcorning or contaminated board surface conditions.
SHORTS
Shorts are easily found using X-ray.
INSUFFICIENT REFLOW
Insufficient reflow is usually a little more difficult to spot. Some of the characteristics of a solder joint, which has not reflowed properly, include rough grainy appearances on the edges of the solder joint and an irregular shape of the joint.
DOMING
Doming is a defect common when a package has not been stored in nitrogen or other types of non-humidity chambers. The characteristics of the doming effect are the center solder joints of the BGA are slightly smaller than those on the outside edge.
POTATO CHIPPING
Potato chipping occurs when a component's outside edge lifts up from a pad. This will cause the center joints to appear squashed as a result of overheating the component.
VOIDS
Voids are usually found on boards which have not been through reflow long enough. They are typically created by flux gases that are unable to escape.
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