PCB X-Ray Testing

Canada & USA

We offer high-resolution pcb x-ray inspection of:

  • BGAs
  • Micro BGAs
  • Chip scale packages
  • Large board capability is also suitable for inspection of bare boards

     VJ-1000 LP X-Ray Testing

Faults Inspected


Opens are usually caused by insufficient reflow, missing balls, doming, pop corning or contaminated board surface conditions.

pcb XRay Testing



Shorts are easily found using X-ray.

PCB XRay Testing



Insufficient reflow is usually a little more difficult to spot. Some of the characteristics of a solder joint, which has not reflowed properly, include rough grainy appearances on the edges of the solder joint and an irregular shape of the joint.



Doming is a defect common when a package has not been stored in nitrogen or other types of non-humidity chambers. The characteristics of the doming effect are the center solder joints of the BGA are slightly smaller than those on the outside edge.



Potato chipping occurs when a component's outside edge lifts up from a pad. This will cause the center joints to appear squashed as a result of overheating the component.



Voids are usually found on boards which have not been through reflow long enough. They are typically created by flux gases that are unable to escape.

These companies trust their PCB assembly to M.I.S.


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